200 mm Characterization and Test

Fraunhofer IPMS Dresden researches, develops and manufactures innovative intelligent microsystems (MEMS / MOEMS). These are micromechanical optical systems that combine sensors, actuators, digital and analog circuit components.

The combination of electrical and non-electrical properties in these systems is a challenge for testing and characterization. In addition to the classic electrical test methods, non-electrical, primarily optical measurement and stimulation methods are used. The tests are carried out under class 10 clean room conditions. Planning, test program development and test execution are carried out in close coordination with our clients. 

The integration of special devices such as laser vibrometers, spectrometers, interferometers or colour measurement cameras allows the combined electrical and mechanical/optical characterization of these microsystems. The electrical control is carried out with mixed-signal test systems, which enable convenient program creation, great flexibility and high test coverage. 

Our test solutions are usually developed on a project basis as part of the product development process and are ready for series production at the customer's request.

To support SMEs, however, we also offer test development and testing as a separate service for small and medium quantities.

We offer the following types of characterization & test

Electrical Characterization

© Fraunhofer IPMS
Characterization at wafer level

To characterize the complex devices and technologies, Fraunhofer IPMS is able to perform the following measurements (in-/ex-situ) both at wafer level and on the individual device:

  • Mixed-signal testing
  • Parametric test system
  • Electro-optical test system for micro-displays and sensors
  • Sensor-actuator test system
  • Non-electrical test
  • CV analysis
  • Insulator integrity and reliability characterization
  • More: Datasheet Electrical Characterization

Automatic Optical Inspection

Automatic Optical Inspection (AOI) of Microsystem dies
© Fraunhofer IPMS
Automatic Optical Inspection (AOI) of Microsystem dies

Our chips often have optically or sensorically active surfaces or tiny mechanical structures that require high quality, but which cannot be tested electrically. Therefore, optical inspection is required. 

Small numbers of such chips can be visually inspected and selected under a microscope, but this method is no longer effective for large numbers. For this reason, Fraunhofer IPMS has developed and set up test equipment that optically inspects microsystem wafers.

Examples of tested chips:

  • MEMS / MOEMS components
  • Multi-field photodetectors for optical measuring systems
  • Organic light emitting diodes (OLED)

More: Datasheet Automatic Optical Inspection

MEMS Manufacturing - Backend and Inline Testing using the example of MEMS scanners

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MEMS Manufacturing - Module Assembly and Inspection Test

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