Ferrolectric Memories
Hafnium oxide-based ferroelectric memories are among the most promising emerging technologies for future ultra-low power non-volatile memory applications. Therefore, Fraunhofer IPMS’ CNT business unit develops fully CMOS-compatible hafnium oxidebased ferroelectric (FE) devices for integration into a wide range of chip technologies. This innovative lead-free material enables the manufacturing of cost-efficient and power-saving CMOS chips.
Our R&D-Services
- FE-Material research and Memory stack process development
- Wafer-loop services with Wafer-Fabs for transfer of FE stacks to existing technology nodes
- Development of innovative memory device and integration concepts
- Advanced physical and electrical characterization from material level to Megabit memory array
- Circuit design of memory test-structures and memory arrays
- System design for in-memory computing solutions