Trade Fair

The Technology Unites Global Summit will take place virtually from February 15-19, 2021, and will offer an exclusive insight into the latest developments in microelectronics, MEMS, Digital Future and Smart Mobility. Join us on February 17 when our expert Bert Kaiser talks about the exciting field of Ultrasonic Recognition. Also don't miss our hosted session on Next Generation Computing on February 17. Visit our virtual booth as well to exchange ideas with our Fraunhofer IPMS scientists via video chat about latest innovative technologies. We are looking forward to seeing you!

February 17, 9 am – 10 am CET

Hosted Session: Advanced technologies and hardware for next generation computing (NGC)

Dr. Wenke Weinreich, Dr. Benjamin Uhlig, Fritz Herrmann
Fraunhofer IPMS

Join Fraunhofer IPMS’ hosted session to learn all about state-of-the art technologies and hardware for next generation computing (NGC) as an enabler for AI, to get closer to human cognition. We will present to you the Fraunhofer Screening Fab, which offers semiconductor grade screening and evaluation services for materials, processes, chemicals and consumables from laboratory scale to production scale (for ULSI) for IC manufacturers and suppliers. Furthermore we share insides of the challenges in high sophisticated MEMS device development and production. We provide experienced scientists, professional wafer handling (ISO 9001) and state-of-the-art equipment for 200/300 mm wafers with short processing times for our customers to reduce costs and the time-to-market.

Don’t miss this opportunity to start your journey to development with us!

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February 17, 5:15 pm – 5:35 pm CET

Talk: All-Silicon Ultrasonic Recognition of the Environment

Dr. Bert Kaiser
Group Leader Monolithically integrated actuator and sensor systems
Fraunhofer IPMS