APECS-Pilotlinie

Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS)

The APECS pilot line: European chiplet innovation

Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems

APECS Logo
APECS project partners

The APECS pilot line at a glance:

As part of the EU Chips Act the APECS pilot line marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation. By providing large industry players, SMEs, and start-ups with easier access to cutting-edge technology, the APECS pilot line will build a strong foundation for resilient and robust European semiconductor supply chains.

Within APECS, the institutes collaborating within the Research Fab Microelectronics Germany (FMD) are working closely with other European partners, making a significant contribution to the European Union´s goals of increasing technological resilience, strengthening cross-border collaboration and enhancing its global competitiveness in the semiconductor technologies.

 

APECS is the novel pan-European pilot line to establish a groundbreaking infrastructure for heterogeneous integration and advanced packaging

Europe's investment in semiconductor research, through strategic projects such as APECS in the EU Chips Act, is crucial to reduce our dependence on international supply chains that are heavily concentrated in other regions. By boosting technological sovereignty, APECS is securing Europe's long-term economic stability and positioning the EU as an indispensable partner in the technological breakthroughs that lie ahead for the digital age. Furthermore, APECS will play a pivotal role in Europe's transition towards a carbon-neutral and circular economy through its promotion on eco-design and green manufacturing initiatives.

APECS will be a key driver of collaboration among European RTOs, industry and academia, fostering a lively innovation ecosystem. Customers will benefit from a single point of contact to the APECS pilot line. APECS covers end-to-end design and pilot production capabilities, to accelerate progress from cutting-edge research to practical, scalable manufacturing solutions.

The APECS consortium brings together the technological competences, infrastructure, and know-how of ten partners from eight European countries: Germany (Fraunhofer-Gesellschaft as coordinator, FBH, IHP), France (CEA-Leti), Belgium (imec), Finland (VTT), Austria (TU Graz), Greece (FORTH), Spain (IMB-CNM, CSIC) and Portugal (INL).

Fraunhofer IPMS in APECS

Fraunhofer IPMS plays a crucial role in the APECS pilot line and will drive the project's goals in chiplet development and integration technology. One part deals with the design of the chiplet system, where we build innovative system architectures for computing, artificial intelligence and MEMS sensors/actuators. The second major part covers new chiplet integration technologies on 200 and 300 mm wafers, including 3D stacking and 2.5D wafer-level integration, ultra-high density functional interposers and CMOS and MEMS/non-silicon chiplets. A major part of our contribution is the development of quasi-monolithic integration (QMI), which will set new standards in chiplet integration technology.

Within the framework of APECS, we are also working on the implementation of functional safety requirements in the design of integrated circuits. To this end, we are developing design flows for the modeling of IP cores, which we are implementing using our RISC-V and TSN IP cores as examples.

Research in the areas of characterization, testing and reliability round off our research portfolio.

Overview

APECS Pilot Line

Design flows & system design

APECS Pilot Line

Heterointegration into quasi-monolithic integration

APECS Pilot Line

Chiplet integration (2.5D and 3D)

APECS Pilot Line

Analytics and metrology / Characterization, testing and reliability

APECS Pilot Line

Demos & application solutions

Further information:

 

Press Release

European chiplet innovation

APECS pilot line goes into operation under the EU Chips Act

 

Website

APECS

Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems

Funding

APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the Chips for Europe Initiative. Thanks to substantial funding from the German Federal Ministry of Education and Research (BMBF) and the federal states of Saxony, Berlin, Bavaria, Schleswig-Holstein, Baden-Württemberg, North Rhine-Westphalia, Brandenburg, and Saxony-Anhalt, it will be possible to further expand the R&D infrastructure in the coming years within the framework of the APECS pilot line.