Fraunhofer Institute for Photonic Microsystems
The APECS pilot line: European chiplet innovation
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
The APECS pilot line in a nutshell
- The holistic system design as access to an efficient and robust design environment for fully integrated systems as well as the fundamental ability to create system designs in the new technologies.
- Development and provision of technological process chains for component and chiplet integration using advanced packaging technologies to implement a chiplet-based system concept.
- Characterization, Test & Reliability (CTR), in which new concepts for quality assurance, safety and yield improvement are developed and provided.
- APECS supports the objectives of the European Green Deal by promoting sustainable technologies, minimizing energy consumption, reducing environmental impact, and enhancing resource efficiency. Through initiatives such as systemic eco-design and green manufacturing, APECS contributes to Europe's transition to a carbon-neutral and circular economy.
Vision
APEC’s vision is to innovate where European industry and science need it most, aspiring to become the leading European platform for advanced packaging and heterogeneous integration innovation. By envisioning a future where the European semiconductor industry is internationally competitive and a driving force behind next-generation integrated systems, APECS aims to build a resilient and thriving community that empowers companies—from startups and SMEs to industry leaders—to play a key role in the global semiconductor market. Through diverse technologies, multi-level collaboration, and seamless access to cutting-edge solutions, the APECS Pilot Line bridges the gap between research, industry, and policy to enhance Europe’s competitiveness in advanced packaging and heterogeneous integration. As the world's first comprehensive platform for 2.5D and 3D heterogeneous packaging, APECS integrates promising core technologies, including CMOS and III-V for RF, photonics, and sensors. It offers end-to-end design and pilot production capabilities to validate and integrate technologies beyond the current state-of-the-art, ensuring manufacturability with advanced characterization, testing, and reliability assessment. Supported by world-class system design, interconnection, and assembly techniques, all developments align with the European Green Deal to foster sustainability in innovation.
