Integrated Data Memory

© Fraunhofer IPMS
Emerging Memory Research Platform at Fraunhofer IPMS.

Fraunhofer IPMS is offering a wide range of research services on Emerging non-volatile memory (NVM) solutions, like Ferroelectric, MRAM, and RRAM technologies.

With the industrial grade cleanroom, laboratories and more then one decade of experience in NVM research, we offer:

  • Material research and Memory stack process development
  • Transfer of stacks as well as Wafer-loop services with Wafer-Fabs for transfer to existing technology nodes
  • Development of innovative memory device and integration concepts
  • Advanced physical and electrical characterization from material level to Megabit memory array
  • Circuit design of memory test-structures and memory arrays
  • System design for in-memory computing solutions

Potential memory applications & specific key requirements

Datalogging: High endurance, low latency and high storage density
Automotive Sensors: Large temperature range, low power and read stress
In-memory computing: High Retention, linear switching and read stress

Emerging non-volatile memory (NVM) solutions, like Ferroelectric, MRAM, and RRAM technologies redefine the data storage hierarchy, offering advanced solutions that address both performance needs and scaling challenges in modern computing.

Therefore, Emerging memories are crucial in filling performance gaps within the traditional memory hierarchy, offering seamless integration and enhanced performance and scaling capabilities.

The integration of emerging memories into leading-edge CMOS technology showcases the potential for low-cost and high-performance memory solutions, suitable for both embedded and standalone applications.

Potential application scenarios can be data loggers, for which these emerging memory technologies enable accurate and high-endurance data storage solutions, making them ideal for applications that require tracking and recording environmental conditions over extended periods.

In the field of sensors, the unique properties of these memory solutions allow operation of devices with low power consumption and under under various environmental conditions.

Leveraging in-memory computing techniques, these advanced memory solutions facilitate faster data processing directly within the memory arrays, significantly enhancing computational speed and reducing energy consumption in real-time applications.

MRAM stands out with its low voltage and high-speed switching capabilities, making it ideal for placement near processing cores to efficiently bridge the gap between SRAM and DRAM. The introduction of hafnium oxide-based ferroelectric memories brings a new dimension to the memory landscape, promising low power consumption and high-speed operation. 

RRAM and PCM are emerging as scalable and low-power solutions, well-suited for applications requiring both high performance and energy efficiency. Emerging memory technologies provide robust non-volatile solutions, eliminating the need for constant power and frequent refreshing required by traditional volatile memories.

By offering the ability to operate similarly to DRAM while providing non-volatile storage, Storage Class Memory (SCM) technologies like MRAM and RRAM are transforming data storage dynamics.

The integration of ferroelectric memories into leading-edge CMOS technology showcases the potential for low-cost and high-performance memory solutions, suitable for both embedded and standalone applications. Emerging memories are crucial in filling performance gaps within the traditional memory hierarchy, offering seamless integration and enhanced data retention capabilities.

Innovations in resistive and magneto-resistive memory technologies are not only overcoming limitations of conventional memories but also aligning with the needs of advanced computing architectures. The scalability and integration capabilities of hafnium oxide-based ferroelectric memories mark them as pivotal for future developments in nanoelectronic devices and systems.

Addressing wide range of requirements

Memory-Solutions for Automotive, Security and Artificial Intelligence Applications

  • 200/300mm Process and Stack Development including comprehensive state-of-the-art PFA support
  • Embedded Memory Solutions & Testchip
  • CMOS-compatible Process Integration
  • Reliability Characterization and Optimization
  • Circuit Design for Memory- and Compute-In-Memory-Macros

Please select:

 

Integrated Data Memory

Ferrolectric Memories

 

Integrated Data Memory

Resistive Memories

 

Integrated Data Memory

Magnetic Memories