Analog and Mixed Signal IP Core Modules

Fraunhofer IPMS carries out research and development projects for industry and, based on this, we offer turnkey IP core modules. Our customers benefit from years of project experience and the resulting IP cores to reduce development time and costs for their ASIC and SoC designs. We enable a fast and reliable integration of our IP cores into various systems in technologies from 350 nm to 22 nm. Existing IP cores can be adapted to customer-specific requirements.

Our services:

• Analog & Mixed Signal IP Cores
• Customized functional adaptations
• Integration support & customer support
• Analog and mixed signal IP core modules

Analog and mixed signal IP core portfolio:

• IPMS-EMIC - Energy Harvesting Module
• IPMS-ALLCP - All Silicon Charge Pump
• IPMS-TSEN – Ultra Low Power Temperature Sensor