
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
The increasing complexity of materials and semiconductor technologies places high demands on quality assurance. Ensuring the quality, reliability and safety of electronic systems is of crucial importance. During development, characterization, quality assurance, testing and functional safety must be taken into account right from the start. The APECS pilot line follows a holistic closed-loop approach from specification, design and production through to final testing and ensuring hardware safety. This increases both reliability and yield and ensures that the new findings are continuously incorporated into design and production.
Our characterization, test and reliability work includes the development of test technologies, qualification and adaptation of system technologies and CTR (Characterization, Test and Reliability) kits for: