APECS Pilot Line: Analytics and Metrology / Characterization, Testing, and Reliability

Analytics and metrology / Characterization, testing and reliability

Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems

The increasing complexity of materials and semiconductor technologies places high demands on quality assurance. Ensuring the quality, reliability and safety of electronic systems is of crucial importance. During development, characterization, quality assurance, testing and functional safety must be taken into account right from the start. The APECS pilot line follows a holistic closed-loop approach from specification, design and production through to final testing and ensuring hardware safety. This increases both reliability and yield and ensures that the new findings are continuously incorporated into design and production.

Fraunhofer IPMS in the APECS pilot line: analytics and metrology

Our characterization, test and reliability work includes the development of test technologies, qualification and adaptation of system technologies and CTR (Characterization, Test and Reliability) kits for:

  • 2.5D/3D/quasi-monolithic integration: novel and adapted localization techniques for electrical and functional defects in complex 2.5D/3D and QMI components. Development, adaptation and introduction of innovative defect diagnostics and associated analyzers for more complex 2.5/3D and QMI devices
  • Wafer-scale tests
  • Functional testing of modules

Further information:

 

Fraunhofer IPMS

200 mm Characterization & Test

 

Services

300 mm Analytics and Metrology

 

Services

RF-Characterization (300 mm)