Hyperspectral imaging inspection tool for efficient semiconductor production

© DIVE imaging systems Gmbh
Hyperspectral Vision System of DIVE imaging systems GmbH.

Together with DIVE imaging systems GmbH we are working on a joint project within the GreenICT Space - the accelerator program of the competence center "GreenICT@FMD".

The overarching aim of the project idea is to establish hyperspectral vision technology as a production-accompanying screening tool for semiconductor production. The aim is to make the semiconductor production chain more efficient and therefore more environmentally sustainable.

For example, based on the information collected, previously required system control wafers can be saved to a significant extent, faulty production can be recognised earlier and subsequently avoided, new (wafer) designs can be established more efficiently and production capacities can be optimised and utilised in a more resource-efficient manner overall.

This significantly reduces the consumption of materials, energy and consumables per wafer in semiconductor production. considerably.

DIVE's Hyperspectral Vision technology provides fast, contactless, and comprehensive inspection solutions for various industries, ensuring quality, functionality, and cost-efficiency in thin layer and performance surface manufacturing. The technology captures data in a 'hypercube' structure, enabling non-destructive analysis of entire samples. Advanced machine learning algorithms then process this data to deliver actionable insights.

Key Applications:

  • Bipolar Plates: In fuel cells and electrolysers, DIVE's technology inspects anti-corrosion layers on bipolar plates, providing spatially-resolved data on layer thickness, homogeneity, and defects.

  • Printed Circuit Boards (PCBs): It assesses PCB assembly quality, ensuring reliability in electronic devices.
  • Wafer-based Products: The technology inspects entire wafer surfaces and layer thicknesses, crucial for semiconductor manufacturing.

  • Manufacturing Processes: DIVE's Hyperspectral Vision is applicable in various layer deposition processes, including: Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), Spin Coating, Slot-die Coating, Spray Coating

This technology enables precise control over film thickness, homogeneity, chemical compositions, crystallinity, and surface roughness in real-time, making it a novel, cost-efficient, and fast tool for in-line quality control in large-area manufacturing processes.

Further information:

 

Green ICT

Supportet by the Federal Ministry of Education and Research. 

 

Green ICT

Green ICT - Eco-friendly information and communication technology

 

Research Fab Microelectronics Germany (FMD)