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Fraunhofer Institute for Photonic Microsystems
Fraunhofer Institute for Photonic Microsystems
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Applications
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Applications
Smart industrial solutions
Industrial Solutions for Production
Industrial Solutions for Processes
Bio and Health
Diagnostics and Sensors
Medical Imaging
Mobility
Automotive
Space
Evaluation Kits
CMUT Evaluation Kit
Diffractive MEMS Kit: Tilt Micro-Mirror Array
ISFET Evaluation Kit
LiFi-HotSpot Evaluation Kit
LiFi-GigaDock Evaluation Kit
MEMS Scanner Evaluation Kits
Microdisplays and Sensors Evaluation Kits
720p OLED-Microdisplay Evaluation-Kit
Bidirectional OLED Microdisplays Evaluation Kit
High-resolution WUXGA OLED microdisplays Evaluation-Kit
Organic Photodiodes Evaluation Kit
Ultra-low power OLED Microdisplays Evaluation-Kit
Universal Optical Sensor Platform Evaluation Kit
RISC-V Prozessor IP Core Evaluation Kit
Time Sensitive Networking Evaluation Kit
Components and Systems
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Components and Systems
Sensors
Electrochemical Sensors
Ion-sensitive field-effect transistors (ISFET)
Organic Field-Effect Transistors (OFET) and Organic Electrochemical Transistors (OECT)
Characterization of Materials
Optical Sensors
Automotive LiDAR Technology
Bidirectional OLED Microdisplays
Integrated Photonic Devices
MEMS based Spectroscopy Systems
Optical Gap
Organic Photodiodes
Photodiodes
Pyrosensors
Universal Optical Sensor Platform
Spectroscopy Systems and Components
Ion Mobility Spectrometer (IMS)
Compact grating spectrometer
Quantum cascade lasers
FT-IR Scan-Engines
Ultrasonic Sensors
Capacitive Micromachined Ultrasonic Transducer (CMUT)
Lateral Micromechanical Ultrasonic Transducer (L-CMUT)
Piezoelectric Micromachined Ultrasonic Transducers (PMUT)
Data Communication
Li-Fi Optical Data Transmission
Li-Fi-GigaDock
Li-Fi-HotSpot
IP-Cores
Digital IP Core Services
Digital IP Core Modules
Analog and Mixed Signal IP Core Modules
Automotive Network IP Core Designs
Computing
Integrated Data Memory
Magnetoresistive RAM (MRAM)
Ferroelectric Memories
Resistive Random Access Memory (RRAM)
Energy Storage
Silicon Capacitors
Integrated Micro Batteries
300 mm Technology Modules & Test Chips
Nanopatterning / E-Beam Lithography
Metallization
RF Characterization
Actuators
Mechanical Actuators
Nanoscopic Electrostatic Drive – electrostatic MEMS bending transducer
Energy Harvesting
Micromachined Ultrasonic Transducer
MEMS based Micropositioning Platforms
Optical Actuators
MEMS Scanners and Scan Engines
Spatial Light Modulators
Tunable Microlenses
Liquid Crystal Waveguide
Microdisplays
Evaluation Kits
OLED Microdisplay Cleanroom
Cleanrooms
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Cleanrooms
200 mm MEMS Cleanroom
Cleanroom Infrastructure
MEMS Processes
MEMS Devices
Characterization and Test
Back End and Packaging
IC Design
OLED Microdisplay Cleanroom
300 mm CMOS Cleanroom
Nanopatterning / E-Beam Lithography
Atomic Layer Deposition (ALD)
Chemical Mechanical Planarization (CMP)
Wafer Metallization
Wafer Cleaning
300 mm Wafer Services
Analytics and Characterization
Analytics and Metrology
RF Characterization
Research areas
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Research areas
Green ICT / Green IT
Environmentally friendly cleaning technologies in microchip production
Environmentally compatible slurries
FAMES - Towards energy-saving chips for digital, analog and RF
Hyperspectral imaging inspection tool for efficient semiconductor production
IFTiN - GreenClean
Reduction of PFAS in microelectronics
Substitution of NMP
CMP without cerium oxide abrasives
Neuromorphic Computing
3DFerroKI - Hardware-based AI with 3-dimensional ferroelectric memories
ANDANTE - Ai for New Devices And Technologies at the Edge
FeEdge - Innovative compute-in-memory modules for energy-efficient edge AI
MEMION - Memristive Redox Transistors for Neuromorphic Computer Architectures
PREVAIL - Technology platform for neuromorphic chips
SEC-Learn - Sensor Edge Cloud for Federated Learning
Smart IR - AI-based infrared sensors
StorAIge - New storage technology for edge AI applications
TEMPO - Technology and Hardware for Neuromorphic Computing
TKOS - Terahertz-Technologies
VITFOX - Vision transformers with ferroelectric oxides
Quantum Communication
CBQD - Chip-based quantum random device
MiQuE - Compact modules for mobile, free-beam quantum communication
Quant-ID - Quantum Secure Identities for a Digital Future
QuINSiDa - Quantum-based infrastructure networks for safety-critical wireless data communication
QuNET & MOBIXHAP - Mobile Nodes for Quantum Communication
QuNET & FuNK - Compact optical communication systems for quantum-safe information exchange between authorities
SEQUIN - Side-channel resistant module for fiber-optic quantum key distribution
Quantum Computing
ARCTIC - Scalable cryogenic control technology for quantum processors
HalQ - Semiconductor-based quantum computing
MATQu - Materials for Quantum Computing
PhoQuant - Photonic Quantum Computer
QLSI - Quantum Large-Scale Integration with Silicon
QSolid - Quantum computer in the solid state
QUASAR - semiconductor quantum processor with shuttling-based scalable architecture
Qu-Pilot - Pilot production capabilities for quantum technologies
SMAQ - Scalable Optical Modulators for Atomic Quantum Computers
SUQCES - Manufacturing scalable and industry-compatible quantum computing approaches.
TO.QI - Semiconductor technology modules for quantum computing, AI and Internet-of-Things
Trusted Electronics
Silhouette - Silicon Photonics for trusted electronic components
TRAICT II – Trusted resource aware ICT
TrEKISS - Trusted Edge AI for Multi-sensor systems
VE4 - Trusted fault management of energy networks
Velektronik - Platform for trusted electronics
T4T - Distributed manufacturing for innovative and trusted electronics
Media Hub
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Media Hub
Press Releases
Archive
Year 2020
Optical microsystems
X-ray photoelectron spectrometer at Fraunhofer IPMS
Real-time communication for automobiles
Covid-19 Statement
Micro loudspeaker made from silicon
NED audio technology for the market
Fraunhofer IPMS presents communication solutions for modern production
Fraunhofer IPMS develops IP designs for data control
Fraunhofer IPMS develops TSN Switch IP Core
M3 Infekt - Decentralized monitoring of COVID-19 patients
Year 2019
Press Release 2019-02-07
Press Release 2019-02-12
Press Release 2019-03-13
Press Release 2019-03-14
Press Release 2019-03-21
Press Release 2019-03-28
Press Release 2019-04-02
Gesture Recognition Using Ultrasound
Machine Perception - Scanning Eye Providing Robot Sight
Top marks for plastic bottle recycling system
Low-power Chips for AI Applications
More safety for driver assistance systems
Membrane-free MEMS Loudspeakers in Nature Microsystems and Nanoengineering scientific journal
Wireless and battery-free RFID sensor for switchgears
LiDAR technology for autonomous driving
Investments for Beyond-Moore process development and evaluation on 300 mm wafers
Wireless real-time communication via light - Wireless TSN via Li-Fi
Energy-efficient AI system
Year 2018
Year 2017
Year 2016
Year 2015
Press Release 2015-04-17
Year 2014
Year 2013
Year 2012
Year 2011
Year 2010
Year 2009
Year 2008
Year 2007
Year 2021
TSN IP core designs with low latency for automotive on-board networks
Fraunhofer IPMS is part of the European project ASCENT+
Thinking chips: Advanced materials and hardware for next generation computing
Scalable silicon qubits for quantum computers
Sensor platform for IoT and edge computing solutions
Trusted Electronics (Project Velektronik)
Energy-efficient sensor nodes from Fraunhofer
Ultrasonic measurement technology of the future
Towards a quantum processor "made in Germany"
Ultrasound sensor platform for SMEs
Reinforcement of the Institute Management at Fraunhofer IPMS
Project Silhouette launched
Terahertz technologies for visionary innovations
RISC-V Functional Safety Processor IP Core introduced by Fraunhofer IPMS and CAST
Innovative modeling approach for micro loudspeakers
Fraunhofer IPMS RISC-V processor core for functional safety
Stable European industry-scale fabrication value chains for solid-state-based quantum computer developmen
International Conference on Design and Technology in the IC Industry
Industrial automation and communication of the future
Zepowel: Das Internet der Dinge wird grüner
Fraunhofer IPMS presents a scalable TSN multiport switch at the TSN/A conference
Innovative Forschung soll Unternehmen in dünn besiedelten Regionen unterstützen
Noise-indicating lamp
Fraunhofer IPMS presents new technologies at the MST Congress
Innovative technologies for the industry
Year 2022
Risc-V-IP-Core-EMSA5-Lauterbach
Near infrared spectral analysis for mobile applications
Fraunhofer IPMS develops CANsec Controller IP-Core CAN-SEC
Fraunhofer IPMS develops demonstrator with gesture control for OZEANEUM in Stralsund
Miniaturized components of Fraunhofer IPMS
Trustworthy electronics "Made in Germany"
Kick-off for the "Green ICT @ FMD" competence center
Miniaturization saves energy in industrial automation
Modular high-throughput micro-platform for mass data storage of the future
Li-Fi GigaDock® Transceiver on ISS space station
Fraunhofer IPMS presents 200 and 300 mm technologies
Sensor and actuator-based signal preprocessing using AI-based methods
Photonics - Shining technology of the future
Research Fab for quantum and neuromorphic computing
Push-pull principle for loudspeaker concept
Year 2023
Year 2024
Annual Reports
Newsletter Subscription
Scientific publications
Whitepaper
Fraunhofer IPMS Webinars
Events
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Events
2016
ECOC 2016
Electronica
FachPack
Lange Nacht der Wissenschaften
Optatec
Semicon Europa
Semicon West
Sensor & Test
Sensors Expo
sps ipc drives
Vision
CNT - Industry Partner Day
Year 2017
Jahrestagung der DGaO
Embedded World
European MEMS Sensors Summit
Lange Nacht der Wissenschaften
Laser
LogiMAT
MST-Kongress
OFC
Photonics West
Photonix
RFID tomorrow
Sensor & Test
Sensors Expo
Smart Systems Integration
Semicon West
Semicon Europe
sps ipc drives
Fraunhofer IPMS - Industry Partner Day
Workshop LiFi
Year 2018
Analytica
Electronica
Embedded World
European MEMS Sensors Summit
Global LiFi Congress
Hannover Fair
IDTechEX
Lange Nacht der Wissenschaften
LogiMAT
OFC
Optatec
Photonics West
Photonik-Tage Berlin-Brandenburg
Photonix
RFID Journal live
RFID tomorrow
Semicon West
Sensor & Test
Sensors Expo
sps ipc drives
Smart Systems Integration
Smart SysTech
Carbon Nanotubes Workshop @DATE 2018
Technologietag Angewandte Sensorik
Vision
Year 2019
Fraunhofer IPMS - Industry Partner Day
LiFi '19
RFID '19
Automate
Embedded World
Hannover Fair
LogiMAT
OASIS
OFC
Photonics West
RFID Journal live
Smart Systems Integration
Industry Partner Day
Lange Nacht der Wissenschaften
Laser
Sensor & Test
Semicon West
European MEMS Sensors Summit
Automotive LIDAR
RFID tomorrow
MST-Kongress
Miroctech Innovation Summit
Productronica
sps ipc drives
Photonix
TSN/A Conference
GTC
Year 2020
Photonix West
LiFi-Workshops 2020
Sensor und Test
Lange Nacht der Wissenschaften Dresden
Embedded World 2020
Hannovermesse
Automotive Ethernet Congress
MEMS & Imaging Sensors Summit
Medical Wearables
Industry Partner Day 2020
Corona
Semicon West
TSN/A Conference
electronica
Semicon Europe
COMPAMED
Optatec
Photonix - cancelled
SPS
Webinar MEOS
Digitaltag 2020
Vehicle Environment Detection
INDUSTRIAL production + handling
GTC
Bordnetz Kongress
Fraunhofer Solution Days
IEDM Conference 2020
Year 2021
Technology Unites
Automotive Ethernet Congress
SPIE Photonics West
SPIE Photonics West
Semicon Europa
Photonix
MicroFab Summit
International Conference on IC Design and Technology 2021
Medical Wearables
all about automation
TSN/A Conference
SPIE Photonics West
Spatial Light Modulators – Status and Potential for Holography
Webinar: Material development for MRAM and FRAM stacks
Year 2022
Embedded World
SPIE Photonics West
Sensor + Test
OFC
analytica
MEMS Manufacturing
Laser - World of Photonics
Dresden Science Night
All About Automation
World of QUANTUM
Semicon Europa
MEDICA
Photonix
electronica
MEMS & Imaging Sensors Summit 2022
Year 2023
SPIE Photonics West
OFC 2023
embedded World 2023
Sensor + Test
Laser - World of Photonics
MikroSystemTechnik Kongress
Semicon Europa
MEDICA
Night of the Sciences Dresden
Photonix
Year 2024
SPIE Photonics West
analytica 2024
Sensor + Test 2024
Photonix Japan 2024
Semicon West 2024
iCCC 2024
Semicon Europa 2024
Night of the Sciences Dresden
SID - Display Week
24th International Meeting on Information Display (IMID 2024)
SID-ME-Chapter Online-Meeting
W3+ Fair Jena
electronica 2024
Future Forces
International Display Workshop
SID Mid-Europe Chapter (SID-MEC) Autumn Online Talk
Year 2025
SPIE Photonics West
Sensor + Test 2025
Career
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Career
PhD students
Training & Dual Studies
Graduates and professionals
Students
FAQs
Many good reasons that speak for Fraunhofer IPMS
TALENTA - A career booster for women at Fraunhofer
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Welcome
Components and Systems
Computing
300 mm Technology Modules & Test Chips
300 mm Technology Modules & Test Chips
Nanopatterning
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Metallization
Chemical Mechanical Polishing (CMP)
Wafer Metallization
Wafer Cleaning
Data sheet
Wafer Services
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Data sheet
Analytical Services
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Data sheet
300 mm Process Catalogue
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Fraunhofer IPMS
Screening Fab
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Related Links:
Integrated Data Memory
Energy Storage
RF Characterization
Fraunhofer Institute for Photonic Microsystems